| ASTM D5127-07 - 15.4.2007 | ||||||||||||||||||||||||||||||||||||||||
| 1. Scope | ||||||||||||||||||||||||||||||||||||||||
1.1 This guide provides recommendations for water quality related to electronics and semiconductor-industry manufacturing. Six classifications of water are described, including water for line widths as low as 0.09 micron. In all cases, the recommendations are for water at the point of distribution (POD). 1.2 Water is used for washing and rinsing of semiconductor components during manufacture. Water is also used for cleaning and etching operations, making steam for oxidation of silicon surfaces, preparing photomasks, and depositing luminescent materials. Other applications are in the development and fabrication of solid-state devices, thin-film devices, communication lasers, light-emitting diodes, photo-detectors, printed circuits, memory devices, vacuum-tube devices, or electrolytic devices. 1.3 Users needing water qualities different from those described here should consult other water standards, such as Specification D 1193 and Guide D 5196. 1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. | ||||||||||||||||||||||||||||||||||||||||
| 2. Referenced Documents | ||||||||||||||||||||||||||||||||||||||||
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