| ASTM F1709-97(2016) - 1.5.2016 | ||
| 1. Scope | ||
1.1 This specification covers pure titanium sputtering targets used as a raw material in fabricating semiconductor electronic devices. 1.2 This standard sets purity grade levels, physical attributes, analytical methods, and packaging. 1.2.1 The grade designation is a measure of total metallic impurity content. The grade designation does not necessarily indicate suitability for a particular application because factors other than total metallic impurity may influence performance. | ||
| 2. Referenced Documents | ||
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