Description of Process—Magnetic particle examination consists of magnetizing the area to be examined, applying suitably prepared magnetic particles while the area is magnetized, and subsequently interpreting and evaluating any resulting particle accumulations. Maximum detectability occurs when the discontinuity is positioned on the surface and perpendicular to the magnetic flux.

This practice establishes the basic parameters for controlling the application of the magnetic particle method. This practice is written so that it can be specified on the engineering drawing, specification, or contract. It is not a detailed how-to procedure to be used by the inspector and, therefore, must be supplemented by a detailed written procedure that conforms to the requirements of this practice.

1.1 This practice establishes minimum requirements for magnetic particle examination used for the detection of surface or slightly subsurface discontinuities in ferromagnetic material. Guide E 709 can be used in conjunction with this practice as a tutorial.

Note 1—This Practice replaces MIL-STD-1949.

1.2 The magnetic particle examination method is used to detect cracks, laps, seams, inclusions, and other discontinuities on or near the surface of ferromagnetic materials. Magnetic particle examination may be applied to raw material, billets, finished and semi-finished materials, welds, and in-service parts. Magnetic particle examination is not applicable to non-ferromagnetic metals and alloys such as austenitic stainless steels. See Appendix X6 for additional information.

1.3 All areas of this Practice may be open to agreement between the Cognizant Engineering Organization and the supplier, or specific direction from the Cognizant Engineering Organization.

1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.